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S2C Newsletter
2012 Summer Issue

Chairman's Corner
Mon-Ren Chene
Chairman and CTO

We are pleased to announce that we are the first vendor to provide ASIC/SoC prototyping solution based on the biggest FPGA, Xilinx vitex-7 2000T. It was my great pleasure to demonstrate our new V7-based product and to have face-to-face discussions with many of you either at last month’s DAC in San Francisco or at our SoCIP conferences in Shanghai and Beijing in late May.

FPGA-based prototyping has become a critical step for a successful SoC product launch but was not a viable option for some design teams when their design sizes were extremely large and building a prototyping flow became too complex to manage. Our fifth generation product, based on the vitex-7 FPGA, is designed to make prototyping a pleasant experience for designs from 20 Million up to 180 Million ASIC gates with 1 to 9 Xilinx vitex-7 FPGAs on a single board. In addition, we provide a complete solution with prototype creation and debug software; DPI, SCE-MI and C-API co-modeling; and, a large library of Prototype Ready™ IP & Accessories.

IN THIS ISSUE
  • S2C Released Dual vitex-7 2000T FPGA Rapid SoC Prototyping Hardware
  • Prototype-Ready IP jump starts complex SoC Integration with 3D Graphics
  • GUC ARM11 and ARM9 Test Chips Simplifies FPGA prototyping for ARM-based SoC

  • I invite you to change your perception of FPGA-based prototyping which is now practical for SoC/ASIC designs of almost any size, easy to implement and very reliable. A number of customers have adopted our vitex-7 2000T TAI Logic Modules in their design flows in less than 2 months from our V7 product release. As always, I want to hear from you to understand what we can do to improve your SoC prototyping environment. It is by listening to our customer needs that we continue to innovate and deliver the products that you need.

    S2C Released Dual vitex-7 2000T FPGA Rapid SoC Prototyping Hardware

    On May 31st, S2C announced its fifth-generation product, the Dual 7V2000T TAI Logic Module, first among the V7 family, based on two Xilinx’s 28-nm vitex-7 FPGA devices. The Dual V7 TAI Logic Module provides up to 40 million ASIC gates of capacity and 1,200 external I/Os on a single board making it the world’s most compact prototyping hardware for such a high gate capacity.

    The Dual V7 TAI Logic Module has many significant improvements to facilitate higher system prototype performance, reliability and ease-of-use through enhanced remote resource management, power management, clock management and cooling mechanisms. The new V7 TAI Logic Module now supports all the hardware control functions through both the USB and the new Gigabit Ethernet interface.

    Read More >>
    Prototype-Ready IP jump starts complex SoC Integration with 3D Graphics

    TAKUMI Corporation, a Japan-based advanced Graphics Intellectual Properties (IP) provider, has implemented a series of Graphics IP cores on S2C’s rapid FPGA-based prototyping systems including GS3000 and GSV3000 cores. These TAKUMI IP cores have been fully validated in FPGAs based prototypes and can be easily demonstrated to and evaluated by customers. These FPGA-based prototypes significantly reduces system-on-chip (SoC) integration time.

    Graphics IPs today are very complex and require a large number of test patterns to perform the complete hardware verification and software testing. Thus, a reliable, flexible and high-performance FPGA platform is required,” said Hiroyuki Nitta, Executive Director of Research and Development of TAKUMI Corporation. “We have selected S2C as our preferred FPGA platform partner because their products are known for their reliability, interface flexibility to a variety of SoC models and interfaces, and scalability to support designs of various gate counts.”

    Read More >>
    GUC ARM11 and ARM9 Test Chips Simplifies FPGA prototyping for ARM-based SoC

    S2C has added ARM1176 and ARM926 GUC test chip modules to the comprehensive family of Prototype Ready™ accessories used to create FPGA-based prototypes and to interface FPGA-based prototype boards to the user’s target operating environment. The 2 new ARM test chip modules can be used with all S2C SoC/ASIC prototyping hardware including vitex-7 TAI Logic Modules, Stratix-4 TAI Logic Modules, Stratix-4 TAI Verification modules, Virtex-6 TAI Logic Modules and Virtex-6 TAI Verification Modules. The ARM test chips are supplied by Global Unichip Corp. (GUC), the Flexible ASIC Leader™.

    Mon-RenChene, S2C’s Chairman and CTO said, “Many of our customers complained that they had reached limitations mapping ARM cores in FPGAs or using other external ARM solutions for building their SoC prototypes and wanted to see a more straightforward solution. As a result, we have partnered with GUC to supply a straightforward solution using GUC’s ARM1176 and ARM926 test chips with the AMBA bus interfaces brought out directly onto the test chip I/O. These new test chip modules simplify the integration of ARM cores with rest of SoC on a FPGA-based prototype; providing a high performance solution.”

    Read More >>

    About S2C

    Founded and headquartered in San Jose, California, S2C has been successfully delivering rapid SoC prototyping tools since 2003. S2C provides:

    • Rapid FPGA-based prototyping hardware and automation software solution for ASIC/SoC design
    • Prototype Ready™ IP, Platforms, and Accessories
    • System-level design verification and acceleration

    S2C's value is our singular focus on SoC/ASIC development. Our highly qualified engineering team and customer-focused sales force understand our customers’ SoC development needs. S2C’s unique FPGA-based solution, using our patented TAI IP technology, enables designers to quickly assemble FPGA-based SoC prototypes on S2C FPGA boards. This gives customers an early start on software development, typically the long pole item in development schedules. Combining rapid prototyping methodologies with a comprehensive portfolio of Prototype Ready IP and advanced verification and acceleration solutions, S2C solutions greatly reduces the SoC design cycle.

    In addition to the headquarters in San Jose, CA, S2C currently has 4 direct offices located in Shanghai, Beijing, Shenzhen China and Hsinchu, Taiwan. S2C is also the organizer of the annual SoCIP seminar and exhibition in China, which brings SoC designers from the Asia-Pacific region together with international silicon IP and SoC solution vendors. For more information, visit www.s2cinc.com.

    Email: sales@s2cinc.com

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