S2C Limited.
S2C Limited.

What Are The Main Reasons For The Failure Of Soc Design Tape-Out?

What Are The Main Reasons For The Failure Of Soc Design Tape-Out? Sep 22, 2022

Can you believe that experienced people’s words have already become a golden rule in the industry. Moore, an insider, has done it, "The number of transistors that can be accommodated on an IC will double about every 18 months, and the performance will also double."

Since then, the development trend of chips cannot be said to be the same, but to be exactly the same. The size is getting smaller and the scale is getting bigger. Hundreds of millions of transistors are placed in a chip the size of a fingernail, and the manufacturing process has reached the nanoscale invisible to the naked eye, which can only be done by extreme ultraviolet lithography. The exponential increase in integration and complexity has directly caused the development of the entire chip to become a particularly expensive thing. It is as difficult as the pilgrimage to the West for Buddhist Sutra to successfully design an SoC.



What are the main reasons for tape-out failure?


Tape-out is the only way to the success of chip design, but the failure is also commonplace. There are many reasons for tape-out failure, with logical or functional errors accounting for almost 50% of all factors. And design errors account for 50% to 70% of the entire functional defects, becoming the number one enemy of engineers. Therefore, verification is the key to the success or failure of SoC design. After all, this society does not have tape-out insurance to buy.

But SoC verification is extremely complex, accounting for about 70% of the entire development time. To shorten the development cycle, system software development verification and pre-cast verification must be parallelized, which makes prototyping far more advantageous than others.



How important is a mature prototyping solution?


In the past, some engineers would choose to make their own prototyping boards, but the complex design segmentation, timing optimization, board debugging and other issues require engineers to have very rich experience. Coupled with the explosion of large-scale designs, the entire development cycle became extremely stressful.

Engineers are in desperate need of a proven, complete prototyping solution for large-scale SoC designs. At present, only a few leading prototyping system solution providers can meet the need.

Back to list Back to list
Related S2C Complete Prototyping Solutions
High Speed GT Peripherals​
PCIe Gen, PGT Module, PGT I/O connector, MCIO Module, Module Type B, QSFP+ connctors, QSFP + PGT Module, SFP+PGT Module, SATA PGT Module, SerDes, SMA PGT Module, Mini-SAS Module
Neuro
Neuro enables users to quickly access FPGA computing power and CPU cluster resources deployed in data centers or company computer rooms through various terminal devices.
Memory Modules
DDR3 Memory Module, DDR3 Memory Module Type B, 8GB DDR4 Non-ECC,16GB DDR4 ECC
What's New at S2C
Request for Quote
What type of chip are you designing
What is the capacity of the ASIC gate included in the design?
5 million-20 million
20 million-50 million
50 million-100 million
100 million-1 billion
More than 1 billion
Which FPGA do you prefer to use?
Xilinx VU440
Xilinx KU115
Xilinx VU19P
Xilinx VU13P
Xilinx VU9P
Intel S10-10M
Intel S10-2800
Not sure, need professional advice
What kind of FPGA configuration do you need?
Single FPGA
Dual FPGA
Four FPGAs
Eight FPGAs
Not sure, need professional advice
What kind of peripheral interface do you need?
How many prototype verification platforms do you need?
Do you need the following tools?
Segmentation tool
Multiple FPGA debugging tools
Co-modeling tool (allows large amounts of data to interact between FPGA and PC host)
When do you need to use our products?
0-6 months
6-12 months
More than 12 months
Not sure
Any additional comments?