Prospective Customers Can Rapidly Develop SoCs using Tensilica Processor Core Reference Designs Built on S2C's FPGA-Based SoC Design Platform
SANTA CLARA, Calif. — February 5, 2007—Tensilica® Inc. today announced a new SoC (system-on-chip) prototyping partnership with S2C Inc., a leading provider of innovative FPGA-Based SoC Design (electronic system level) and SoC prototyping solutions with a rapidly growing presence in the China market. S2C has already deployed Tensilica's Diamond Standard 108mini processor core into its TAI Logic Module FPGA-Based SoC Design platform, and is working on a reference design and demonstration platform for Tensilica's popular Diamond Standard 330HiFi Audio core.
"Amid increasingly shorter and more intense product design cycles in China, we are committed to providing integrated SoC design solutions that accelerate our customers' product time-to-market," said Toshio Nakama, CEO of S2C. "By partnering with Tensilica, we are able offer the widest, most comprehensive range of out-of-the-box processor cores on FPGA platforms for customers to integrate in their SoC designs. Our customers can thus stay ahead of the design curve and reduce the time taken by several key steps in the design process."
"S2C will be a valuable partner in helping us speed up the adoption of our Diamond Standard processors in China," stated Steve Roddy, Tensilica's vice president of marketing. "Customers will be able to rapidly evaluate and implement our processor cores into their SoC prototypes that can run at near-real time and real time speeds and accelerate hardware/software co-design."
S2C's FPGA-Based SoC Design solutions let designers easily and securely access IP in FPGA-based formats to quickly assemble SoC prototypes and start software development immediately. S2C's core products comprise TAI Pod, a hardware module that links FPGA prototypes to PC through a USB2.0 interface; TAI Player, a software application that automates compile flow and interfaces to TAI Pod for runtime, debugging, and security functions; and TAI Logic Module, a scalable and cost-effective FPGA prototyping module. Collectively, these products have been proven to eliminate three to six months from S2C customers' design cycles.
Tensilica's Diamond Standard processors are off-the-shelf synthesizable cores that range from area-efficient, low-power controllers to audio and video processors and a high-performance DSP, all of which lead the industry in their respective categories both in power efficiency and high performance. The Diamond Standard processors are supported by an optimized set of Diamond Standard software tools and a wide range of industry infrastructure partners. They are available directly from Tensilica and through a growing list of ASIC and foundry partners.
About S2C Based in San Jose, California and with offices in Beijing and Shanghai, China, S2C Inc. develops and produces advanced FPGA-Based SoC Design and SoC prototyping solutions that accelerate and simplify the integration of embedded systems into chips. For additional information, please visit www.s2cinc.com.
About Tensilica Tensilica offers the broadest line of controller, CPU and specialty DSP processors on the market today, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica's low-power, benchmark proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica's patented approach to the creation of application-specific building blocks for SoC design, visit www.tensilica.com.
For more information, contact: Allen Tan, Corporate Marketing Manager for S2C (408) 213-8818, firstname.lastname@example.org
Ryan Li +8610 8251 1588 , email@example.com
Yvonne Xiong +8610 8776 5262, firstname.lastname@example.org